The MERCURY System is a semi-automated batch spray processor designed for 250nm and 180nm technologies, supporting wafer sizes from 100mm to 200mm. It offers an on-wafer temperature capability of up to 120°C. With appropriate upgrades, the MERCURY can handle smaller feature sizes, down to 130nm or 90nm. Its precision spray technology ensures high uniformity and accuracy in cleaning, resist stripping, and etching at smaller scales. For nodes smaller than 90nm, necessary upgrades include improved chemical delivery, process control, and contamination management to meet strict process demands.

The system provides enclosed processing in a controlled, nitrogen-purged environment to eliminate contamination carry-over. It rinses and dries wafers after all chemical cycles are complete and supplies uniform delivery of fresh chemicals for each process. The MERCURY System targets performance levels based on 0.25µm and 0.18µm geometry SEMI design rules.

Key advantages of the MERCURY System include low capital and ownership costs in a compact footprint, making it ideal for fabs seeking high throughput and cost efficiency. The system’s flexibility suits emerging markets such as power devices, MEMS, and sensors. With minimal hardware adjustments, it can process wafer batches of 100mm, 150mm, and 200mm, ensuring production flexibility.

Applications:

• Front-end-of-line (FEOL) fabrication: Forming integrated circuits or transistors on silicon wafers.

• Back-end-of-line (BEOL) fabrication: Forming metal wiring levels on the wafer surface.

• Packaging wafer cleaning and surface preparation: Necessary cleaning, etching, and stripping for microelectronic devices.

Process applications:

• SPM, dHF, SC1, SC2 cleans

• Post-etch and post-ash cleans

• Photoresist strip applications

• Wet etch/strip of metal films for silicide

• BEOL post cleans

MERCURY MP

BATCH SPRAY CLEANING SYSTEM